DreamVision Multi GPU HPC 4X

From
$5,329 RRP (Inc-GST)

Specifications

CPU	Intel® Socket 2066 Core™ X-Series Processors Supports Intel® Virtual RAID on CPU (VROC) Supports Intel® 14 nm CPU Supports Intel® Turbo Boost Max Technology 3.0 * The Intel® Turbo Boost Technology 3.0 Support Depends on the CPU types.
Chipset	Intel® X299
Memory	Intel® Core™ X-series Processors (6-core above) 8 x DIMM, Max. 256GB, DDR4 4200(O.C.)/4133(O.C.)/4000(O.C.)/3600(O.C.)/2933/2666/2400/2133 MHz Non-ECC, Un-buffered Memory Intel® Core™ X-series Processors (4-core) 4 x DIMM, Max. 64GB, DDR4 4200(O.C.)/4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400/2133 MHz Non-ECC, Un-buffered Memory Supports Intel® Extreme Memory Profile (XMP) * Hyper DIMM support is subject to the physical characteristics of individual CPUs. * Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU. * Only on Select SKUs, With 1 DIMM per channel. Additional DIMM loading on any channel may impact maximum memory speed by one bin.
Multi-GPU Support	Supports NVIDIA® 4-Way SLI™ Technology Supports AMD 4-Way CrossFireX Technology
Expansion Slots	7 x PCIe 3.0 x16 (single x16 or dual x16/x16 or triple x16/x16/x16 or quad x16/x16/x16/x16 or seven x16/x8/x8/x8/x8/x8/x8)
Storage	Intel® X299 Chipset : 1 x M.2 Socket 3, , with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode) 1 x M.2 Socket 3, , with M key, type 2242/2260/2280 storage devices support (PCIE 3.0 x 4 mode) 8 x SATA 6Gb/s port(s) 1 x U.2 connector, Support Raid 0, 1, 5, 10 Support Intel® Rapid Storage Technology enterprise 5.1 for X-Series(6-core and above) CPU RAID Supports Intel® Smart Response Technology Intel® Rapid Storage Technology 15 support Intel® Optane™ Memory Ready Intel® Virtual RAID (VROC) support for CPU RAID
LAN	Intel® X550-AT2 , 2 x 10 Gigabit LAN Controller(s)
Audio	Realtek® ALC S1220A 7.1-Channel High Definition Audio CODEC - Power pre-regulator reduces power input noise to ensure consistent performance - Impedance sense for front and rear headphone outputs - Internal audio Amplifier to enhance the highest quality sound for headphone and speakers - Supports : Jack-detection, Multi-streaming, Front Panel Jack-retasking, Front Panel MIC Jack-retasking - High quality 120 dB SNR stereo playback output (Line-out at rear) and 113 dB (Line-in) - Supports up to 32-Bit/192kHz playback Audio Feature : - DTS Connect - DTS Headphone:X - Optical S/PDIF out port(s) at back panel - Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference - Premium Japanese audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity - Unique de-pop circuit: Reduces start-up popping noise to audio outputs Separate layer for left and right track, ensuring both sound deliver equal quality
USB	Intel® X299 Chipset : 6 x USB 3.1 Gen 1 port(s) (4 at back panel, , 2 at mid-board) ASMedia® USB 3.1 Gen 2 controller : 2 x USB 3.1 Gen 2 port(s) (2 at back panel, , Type-A + USB Type-CTM) ASMedia® USB 3.1 Gen 2 controller : 1 x USB 3.1 Gen 2 port(s) (1 at mid-board)
Operating System Support	Windows® 10 64-bit
Back I/O Ports	2 x LAN (RJ45) port(s) 1 x USB 3.1 Gen 2 (teal blue)Type-A, 1 x USB 3.1 Gen 2 (black)Type-C 1 x Optical S/PDIF out 1 x 8-channel Audio I/O 4 x USB 3.1 Gen 1 (blue)
Form Factor	CEB Form Factor
Environment	Operation temperature: 10℃ ~ 35℃ Non operation temperature: -40℃ ~ 70℃ Non operation humidity: 20% ~ 90% ( Non condensing)